US Patent Issued to Besi Netherlands on Aug. 12 for "Mould half and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such" (Dutch Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,384,081, issued on Aug. 12, was assigned to Besi Netherlands B.V. (Duiven, Netherlands).

"Mould half and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such" was invented by Wilhelmus Gerardus Jozef Gal (Duiven, Netherlands) and Albertus Franciscus Gerardus van Driel (Duiven, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a mould half for a mould for transfer moulding encapsulating electronic components mounted on a carrier, where the mould part to support the carrier has a contact surface that includes a prim...