ALEXANDRIA, Va., Nov. 18 -- United States Patent no. D1,102,566, issued on Nov. 18, was assigned to BendPak Inc. (Agoura Hills, Calif.).
"Heater module" was invented by Larry L. Franklin Jr. (Camarillo, Calif.) and Jeffrey S. Kritzer (Moorpark, Calif.).
The patent was filed on Oct. 31, 2023, under Application No. D/915,497.
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