US Patent Issued to Beijing Xiaomi Mobile Software on Aug. 5 for "Metal surface layer treating method, metal assembly and electronic device" (Chinese Inventor)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,378,664, issued on Aug. 5, was assigned to Beijing Xiaomi Mobile Software Co. Ltd. (Beijing).

"Metal surface layer treating method, metal assembly and electronic device" was invented by Bing Liu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure provides a metal surface layer treating method, a metal assembly and an electronic device. The metal surface layer treating method includes: putting metal into a vacuum chamber, and vacuumizing the vacuum chamber to a first vacuum degree; adding a mixed gas of acetylene, nitrogen and hydrogen into the vacuum chamber; and heating the vacuum chamber to a temperature above an ambient temperature....