US Patent Issued to Beijing University of Civil Engineering and Architecture, China Electronics Engineering Design Institute on Sept. 2 for "Denitrification and dephosphorization composite filler, preparation method and application" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,403,450, issued on Sept. 2, was assigned to Beijing University of Civil Engineering and Architecture (Beijing) and China Electronics Engineering Design Institute Co. Ltd. (Beijing).

"Denitrification and dephosphorization composite filler, preparation method and application" was invented by Haiyan Li (Beijing), Zhaoying Liu (Beijing), Yingjie Shen (Beijing), Haijun Zhang (Beijing), Ziyang Zhang (Beijing), Meipeng Jian (Beijing), Chaohong Tan (Beijing) and Yuanping Fang (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a denitrification and dephosphorization composite filler, a preparation method and application. The c...