US Patent Issued to BEIJING NAURA MICROELECTRONICS EQUIPMENT on Sept. 30 for "Semiconductor heat treatment device and method for controlling pressure in process chamber" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,368, issued on Sept. 30, was assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT Co. LTD. (Beijing).

"Semiconductor heat treatment device and method for controlling pressure in process chamber" was invented by Yan Jia (Beijing), Dan Geng (Beijing) and Zhimin Chen (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of controlling a pressure in a process chamber of a semiconductor heat treatment device includes: obtaining an actual pressure value in the process chamber; determining a first valve opening value for controlling opening an exhaust valve according to a difference between the actual pressure value and a preset target pressure...