US Patent Issued to BEIJING NAURA MICROELECTRONICS EQUIPMENT on Sept. 16 for "Semiconductor apparatus and heating device in semiconductor apparatus" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,932, issued on Sept. 16, was assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT Co. LTD. (Beijing).

"Semiconductor apparatus and heating device in semiconductor apparatus" was invented by Bing Li (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure discloses a heating device in a semiconductor apparatus and the semiconductor apparatus, including a heating body configured to carry a wafer, a heating member configured to generate heat being arranged in the heating body; and a cooling structure, which is arranged on the heating body below, and a cooling structure being arranged below the heating body. The cooling structure ...