ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,578, issued on July 29, was assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT Co. LTD. (Beijing).

"Semiconductor process device and wafer transfer system thereof" was invented by Donghua Zhao (Beijing) and Yingjun Si (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer transfer system includes a wafer tray and a wafer separation assembly. The wafer tray includes a tray body and a center tray, a tray hole is formed at a center of the tray body penetrating the tray body in a thickness direction, and the center tray is disposed in the tray hole and is detachably placed at the tray body. The wafer separation assembly includes a tray suppor...