ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,387, issued on Dec. 9, was assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT Co. LTD. (Beijing).

"Heating device and semiconductor processing apparatus" was invented by Xiqiang Tian (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heating device includes a heating assembly. The heating assembly includes a ventilation structure configured to blow gas to an edge of a to-be-processed workpiece carried by the heating device. The heating device further includes a base arranged on a side of the heating assembly away from a heating surface of the heating assembly. A mounting space is formed between the base and the heating assembly. The heating ...