US Patent Issued to Beijing KMT Technology on Sept. 23 for "Reactive organosilicon thixotropic agent, organosilicon encapsulation adhesive and LED element" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,414, issued on Sept. 23, was assigned to Beijing KMT Technology Co. Ltd. (Beijing).

"Reactive organosilicon thixotropic agent, organosilicon encapsulation adhesive and LED element" was invented by Zuozhu Deng (Beijing), Jing Ma (Beijing) and Huijuan Liu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a reactive organosilicon thixotropic agent, an organosilicon encapsulation adhesive containing the reactive organosilicon thixotropic agent, and an LED element encapsulated by using the organosilicon encapsulation adhesive. In the present disclosure, the reactive organosilicon thixotropic agent is prepared by a hydrosilylation reac...