US Patent Issued to BEIJING HENGXIANG HONGYE FOUNDATION REINFORCEMENT TECHNOLOGY on Nov. 11 for "Lifting and reinforcing process for dust-free factory floor" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,467,219, issued on Nov. 11, was assigned to BEIJING HENGXIANG HONGYE FOUNDATION REINFORCEMENT TECHNOLOGY Co. LTD. (Beijing).

"Lifting and reinforcing process for dust-free factory floor" was invented by Tengyue Cui (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed in the present invention is a lifting and reinforcing process for a dust-free factory floor, including: reinforcing a soft foundation and precisely lifting a settlement range. Reinforcing a soft foundation includes: step 1: determining a depth of a soft soil layer in an inner settlement area of the factory, and designing a drilling curve; step 2: drilling guiding holes from the...