US Patent Issued to BEIJING FORESTRY UNIVERSITY, POWER DEKOR GROUP, HUNAN FORESTECH NEW MATERIALS on June 24 for "Formaldehyde-free medium-high-density board capable of meeting deep facing requirements and method for manufacturing same" (Chinese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,337,501, issued on June 24, was assigned to BEIJING FORESTRY UNIVERSITY (Beijing), POWER DEKOR GROUP Co. LTD. (Shanghai) and HUNAN FORESTECH NEW MATERIALS Co. LTD. (Zhuzhou, China).

"Formaldehyde-free medium-high-density board capable of meeting deep facing requirements and method for manufacturing same" was invented by Runcang Sun (Beijing), Tongqi Yuan (Beijing), Xiaolong Chen (Beijing), Supeng Wang (Beijing), Yueying Chen (Beijing) and Xianpeng Zhou (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a formaldehyde-free medium-high-density board capable of meeting deep facing requirements, and a method for manufac...