US Patent Issued to Beijing E-Town Semiconductor Technology, Mattson Technology on May 20 for "Workpiece processing apparatus with plasma and thermal processing systems" (Chinese, German Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,209, issued on May 20, was assigned to Beijing E-Town Semiconductor Technology Co. Ltd. (Beijing) and Mattson Technology Inc. (Fremont, Calif.).

"Workpiece processing apparatus with plasma and thermal processing systems" was invented by Dieter Hezler (Lonsee-Halzhausen, Germany), Keli Huang (Wuhan, China), Jianmin Ji (Beijing), Deqiang Zeng (Shanghai) and Manuel Sohn (Neu-Ulm, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A processing apparatus for processing a workpiece is presented. The processing apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing cham...