US Patent Issued to Beijing E-Town Semiconductor Technology, Mattson Technology on March 25 for "Electrostatic chuck assembly for plasma processing apparatus" (California Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,073, issued on March 25, was assigned to Beijing E-Town Semiconductor Technology Co. Ltd. (Beijing) and Mattson Technology Inc. (Fremont, Calif.).

"Electrostatic chuck assembly for plasma processing apparatus" was invented by Maolin Long (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrostatic chuck including a workpiece support surface, clamping layer, heating layer, thermal control system, and sealing band is disclosed. The sealing band surrounds an outer perimeter of the electrostatic chuck including at least a portion of the workpiece surface. The sealing band has a width greater than about 3 millimeters (mm) up to a...