ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,273, issued on Jan. 27, was assigned to Beijing E-Town Semiconductor Technology Co. Ltd. (Beijing) and Mattson Technology Inc. (Fremont, Calif.).
"Workpiece processing apparatus with thermal processing systems" was invented by Manuel Sohn (Ulm, Germany), Alex Wansidler (Blaustein, Germany), Dieter Hezler (Lonsee-Halzhausen, Germany), Joseph Cibere (Burnaby, Canada), Rolf Bremensdorfer (Bibertal, Germany), Martin Zucker (Orinda, Calif.), Pete Lembesis (Boulder Creek, Calif.) and Michael Yang (Palo Alto, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A processing apparatus for a thermal treatment of a workpiece is presented. The processing appa...