ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,078, issued on Nov. 25, was assigned to BEIJING DAXIANG BIOTECH Co. LTD (Beijing).
"3D multi-organ co-culture chip" was invented by Rongrong Xiao (Beijing) and Yu Zhou (Beijing).
According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D multi-organ co-culture chip is provided by present disclosure and comprises a chip body, wherein one or more groups of culture modules are arranged on the chip body; an each group of the culture modules comprises a fluid storage hole of which an end is open and is positioned at an upper surface of the chip body; a first culture micropore which is positioned below a corresponding fluid storage hole and communicates with the c...