ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,535, issued on May 13, was assigned to Beijing Bytedance Network Technology Co. Ltd. (Beijing).
"Modular air cooling device and cooling system" was invented by Jian Wang (Beijing), Bin Lin (Beijing), Zhichao Lv (Beijing), Shifeng Wang (Beijing), Yulong Wang (Beijing) and Ruidong Wang (Beijing).
According to the abstract* released by the U.S. Patent & Trademark Office: "The embodiments of the present disclosure provide a modular cooling device and a cooling system. The device includes: an air cooling box adapted to sealingly receive a predetermined number of electronic devices to be cooled; and a heat exchange unit coupled to the air cooling box and comprising: a housing sealingly...