US Patent Issued to Beijing BOE Technology Development, BOE TECHNOLOGY GROUP on Jan. 20 for "Methods for forming via hole and filling via hole in flexible substrate" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,749, issued on Jan. 20, was assigned to Beijing BOE Technology Development Co. Ltd. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Methods for forming via hole and filling via hole in flexible substrate" was invented by Shuo Zhang (Beijing), Kui Liang (Beijing), Tuo Sun (Beijing) and Chao Zhou (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method for forming a via hole in a flexible substrate, including: providing a base substrate and forming a de-bonding layer on the base substrate; forming a seed metal layer on the de-bonding layer, and patterning the seed metal layer to form a first conductive p...