US Patent Issued to Beijing BOE Technology Development, BOE TECHNOLOGY GROUP on Aug. 19 for "Chip loading structure, analysis device, and analysis system" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,390,807, issued on Aug. 19, was assigned to Beijing BOE Technology Development Co. Ltd. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Chip loading structure, analysis device, and analysis system" was invented by Mengjun Hou (Beijing), Xiangguo Ma (Beijing), Kai Geng (Beijing), Qiong Wu (Beijing), Youxue Wang (Beijing) and Zongmin Liu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip loading structure, an analysis device and an analysis system are provided. The chip loading structure includes a loading plate body having therein an accommodating space adapted to accommodate a detection chip; a first hollow area and at least one seco...