US Patent Issued to BEIJING BOE OPTOELECTRONICS TECHNOLOGY, BOE TECHNOLOGY GROUP on Jan. 27 for "Microfluidic substrate and manufacturing method therefor, and microfluidic chip" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,670, issued on Jan. 27, was assigned to BEIJING BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Microfluidic substrate and manufacturing method therefor, and microfluidic chip" was invented by Shanshan Xu (Beijing) and Zhao Chen (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microfluidic substrate includes an electrode substrate and a dielectric layer disposed on a side of the electrode substrate. The dielectric layer includes a dielectric material, and a molecular structure of the dielectric material has a hydrophobic group."

The patent was filed on Dec. 13, 2019, under Application No. 17/...