US Patent Issued to BEIHANG UNIVERSITY on Oct. 21 for "Low-loss coplanar waveguide bonding structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,449,618, issued on Oct. 21, was assigned to BEIHANG UNIVERSITY (Beijing).

"Low-loss coplanar waveguide bonding structure and manufacturing method thereof" was invented by Chen Xiao (Beijing), Rui Xu (Beijing), Boyu Zhang (Beijing), Xiangyu Zheng (Beijing), Wenlong Cai (Beijing), Jiaqi Wei (Beijing) and Weisheng Zhao (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a low-loss coplanar waveguide bonding structure and a manufacturing method thereof, relating to the technical field of semiconductor. The low-loss coplanar waveguide bonding structure includes: a first coplanar waveguide on a first substrate, a second coplanar waveguide on...