US Patent Issued to BEIHAI HUIKE PHOTOELECTRICS TECHNOLOGY, HKC on Nov. 11 for "Method of fabricating array substrate and array substrate thereof" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,374, issued on Nov. 11, was assigned to BEIHAI HUIKE PHOTOELECTRICS TECHNOLOGY Co. LTD. (Beihai, China) and HKC CORPORATION LIMITED (Shenzhen, China).

"Method of fabricating array substrate and array substrate thereof" was invented by Song Sun (Beihai, China), Qin Xiong (Beihai, China), Jinsong Lu (Beihai, China), Je-Hao Hsu (Beihai, China) and Haijiang Yuan (Beihai, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating an array substrate and an array substrate are disclosed. The array substrate includes a bonding portion, the bonding portion being fabricated by: providing a substrate, and forming a metal layer on the substrat...