US Patent Issued to Battelle Memorial Institute on Oct. 14 for "Assembly and method for performing in-situ endpoint detection when backside milling silicon based devices" (Ohio Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,658, issued on Oct. 14, was assigned to Battelle Memorial Institute (Columbus, Ohio).

"Assembly and method for performing in-situ endpoint detection when backside milling silicon based devices" was invented by Jeremiah J. Schley (Dublin, Ohio), Thomas Kent (Columbus, Ohio), Katie T. Liszewski (Powell, Ohio) and Isaac Goldthwaite (Columbus, Ohio).

According to the abstract* released by the U.S. Patent & Trademark Office: "An assembly for monitoring a semiconductor device under test comprising a mill configured to mill the device, a sensor configured to measure an electrical characteristic of the device, and a computer configured to determine the amount of strain in the device from...