ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,428,520, issued on Sept. 30, was assigned to BASF SE (Ludwigshafen am Rhein, Germany).
"Epoxy resin composition" was invented by Miran Yu (Ludwigshafen am Rhein, Germany), Guenter Scherr (Ludwigshafen am Rhein, Germany), Marco Arnold (Ludwigshafen am Rhein, Germany), Dieter Mayer (Ludwigshafen am Rhein, Germany) and Madhura Shreekar Pawar (Ludwigshafen am Rhein, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a resin composition, comprising (a) an epoxy resin; (b) a curing agent comprising the structure of formula C1; (c) an inorganic filler; wherein RC1 is (a) a siloxane group of formula C1a or (b) or both a sil...