ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,215,213, issued on Feb. 4, was assigned to BASF SE (Ludwigshafen am Rhein, Germany).
"Thermoplastic moulding compound" was invented by Jens Cremer (Ludwigshafen, Germany) and Patrick Spies (Ludwigshafen, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein is a method of using glass fibers having a tensile strength according to DIN ISO 527-5 of 86.0 to 92.0 GPa, a tensile elastic modulus according to DIN ISO 527-5 of 2600 to 3200 MPa and a softening point according to DIN ISO 7884-1 of 900deg C. to 950deg C., the method including using the glass fibers to increase an impact strength and/or breaking elongation of molded articles made of...