ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,082, issued on June 24, was assigned to Baidu USA LLC (Sunnyvale, Calif.).
"Chip cooling package with multiple fluid paths" was invented by Tianyi Gao (Sunnyvale, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling plate for cooling chip having redundant cooling fluid circulation. A primary fluid cooling loop removes heat directly from the chip. A secondary cooling loop acts as a condenser for two phase cells, thus removing heat from the chip indirectly. The cold plate may be fabricated as two parts: bottom plate and top plate where is the fluid is divided to primary stream to the bottom plate and secondary stream to top cooling plate. T...