ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,225,693, issued on Feb. 11, was assigned to BAIDU USA LLC (Sunnyvale, Calif.).
"Server packaging for immersion cooling with local acceleration" was invented by Tianyi Gao (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling unit includes a channel frame assembled to a server chassis to form a region enclosing an electronic chip that is disposed on a server board contained within the server chassis, an inlet port coupled to a first side of the channel frame to receive a coolant fluid, an outlet port coupled to a second side of the channel frame for coolant fluid in either a liquid phase or a vapor phase to exit the channel frame, an...