ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,416, issued on Dec. 2, was assigned to BAE Systems Information and Electronic Systems Integration Inc. (Nashua, N.H.).
"Thermally dissipative electromagnetic interference shield or cover for an electronic device" was invented by Sean P. Smith (Merrimack, N.H.), Mark J. Dube (McDade, Texas), Thomas W. Auletto (Northfield, N.H.), Bernard A. Sacco Jr. (Westford, Mass.), Mark L. Hummel (Peterborough, N.H.) and Eric Walther-Grant (Groton, Mass.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A lightweight thermally dissipative EMI shield for electronics is composed of both metallic (e.g., conductive) and non-metallic (e.g., nonconductive) materials. The th...