US Patent Issued to BAE Systems Information and Electronic Systems Integration on Aug. 26 for "Interposer for implementing flip-chip dies in wirebonded circuit assemblies" (New Hampshire Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,942, issued on Aug. 26, was assigned to BAE Systems Information and Electronic Systems Integration Inc. (Nashua, N.H.).

"Interposer for implementing flip-chip dies in wirebonded circuit assemblies" was invented by Nicholas L. Campbell (Nashua, N.H.) and Andrew M. Kraemer (Manchester, N.H.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interposer that enables implementation of a flip-chip die in a wirebonded chip-and-wire circuit assembly includes an insulating substrate having a solder bump pad array on its upper surface that is compatible with the solder bump array of a flip-chip die. Wirebond pads provided along upper edges of the substrate are...