ALEXANDRIA, Va., June 10 -- United States Patent no. 12,292,215, issued on May 6, was assigned to B/E AEROSPACE INC. (Winston-Salem, N.C.).
"Heat pump assembly" was invented by Boguslaw Strzalka (Nysa, Poland) and Dariusz Sapija (Jelcz Laskowice, Poland).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump assembly includes a plurality of Peltier devices mounted to receive air from a common air inlet, means for causing a current to flow through the Peltier devices, a plurality of first heat sinks arranged in thermal contact with a first, hot, side of the Peltier devices, and a plurality of second heat sinks arranged in thermal contact with a second, cold, side of the Peltier devices. Each of the first h...