ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,629, issued on July 29, was assigned to AZUREWAVE TECHNOLOGIES INC. (New Taipei, Taiwan).

"Electromagnetic interference shielding package structure, manufacturing method thereof, and electronic assembly" was invented by Chih-Hao Liao (Taipei, Taiwan), Shu-Han Wu (Taipei, Taiwan) and Hsin-Yeh Huang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electromagnetic interference (EMI) shielding package structure, a manufacturing method thereof, and an electronic assembly are provided. The EMI shielding package structure includes a carrier, at least one chip mounted on a first board surface of the carrier, an encapsulant formed on the car...