US Patent Issued to AZUREWAVE TECHNOLOGIES on Aug. 19 for "Chip package structure and electromagnetic interference shielding package module thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,724, issued on Aug. 19, was assigned to AZUREWAVE TECHNOLOGIES INC. (New Taipei, Taiwan).

"Chip package structure and electromagnetic interference shielding package module thereof" was invented by Chih-Hao Liao (Taipei, Taiwan), Hsin-Yeh Huang (Taipei, Taiwan) and Shu-Han Wu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure and an electromagnetic interference (EMI) shielding package module thereof are provided. The EMI shielding package module includes an encapsulant, an EMI shielding layer, and a recognition contrast layer. The encapsulant has a patterned trench that is recessed in a top surface thereof. The EM...