ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,763, issued on Sept. 16, was assigned to Ayar Labs Inc. (San Jose, Calif.).
"Fiber attach enabled wafer level fanout" was invented by Shahab Ardalan (Santa Clara, Calif.), Michael Davenport (Santa Barbara, Calif.) and Roy Edward Meade (Lafayette, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a v...