US Patent Issued to Ayar Labs on May 27 for "Thermal management system for multi-chip-module and associated methods" (California Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,313,891, issued on May 27, was assigned to Ayar Labs Inc. (San Jose, Calif.).

"Thermal management system for multi-chip-module and associated methods" was invented by Roy Edward Meade (Lafayette, Calif.) and Vladimir Stojanovic (Berkeley, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plurality of lid structures include at least one lid structure configured to overlie one or more heat sources within a multi-chip-module and at least one lid structure configured to overlie one or more temperature sensitive components within the multi-chip-module. The plurality of lid structures are configured and positioned such that each lid structure is separat...