US Patent Issued to Ayar Labs on Dec. 30 for "Chip-last wafer-level fan-out with optical fiber alignment structure" (California Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,402, issued on Dec. 30, was assigned to Ayar Labs Inc. (San Jose, Calif.).

"Chip-last wafer-level fan-out with optical fiber alignment structure" was invented by Roy Edward Meade (Lafayette, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A redistribution layer is formed on a carrier wafer. A cavity is formed within the redistribution layer. An electro-optical die is flip-chip connected to the redistribution layer. A plurality of optical fiber alignment structures within the electro-optical die is positioned over and exposed to the cavity. Mold compound material is disposed over the redistribution layer and the electro-optical die. A residual ...