US Patent Issued to Axus Technology on Aug. 5 for "Method and apparatus for insitu adjustment of wafer slip detection during work piece polishing" (Arizona Inventor)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,377,520, issued on Aug. 5, was assigned to Axus Technology LLC (Chandler, Ariz.).

"Method and apparatus for insitu adjustment of wafer slip detection during work piece polishing" was invented by Daniel Ray Trojan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and apparatus for insitu adjustment of wafer slip detection during work piece polishing are disclosure. In one aspect, a chemical mechanical planarization (CMP) system, includes: a carrier configured to retain a substrate, a platen supporting a polishing pad, and a slip sensor configured to generate a signal indicative of a characteristic of a surface of the polishing pad. ...