ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,498,527, issued on Dec. 16, was assigned to AvicenaTech Corp. (Sunnyvale, Calif.).
"Packaging microLED optical interconnects" was invented by Sunghwan Min (Sunnyvale, Calif.), Robert Kalman (Sunnyvale, Calif.), Bardia Pezeshki (Sunnyvale, Calif.) and Alexander Tselikov (Sunnyvale, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging and assembly of a parallel optical link is disclosed. The packaging and assembly may have four major parts: assembly of the optical transceiver die, 2.5D package assembly, package attachment to a system printed circuit board, and optical coupling attachment. A frame and a removable lid may be attached to the opt...