US Patent Issued to Avary Holding (Shenzhen) Co. Ltd., QING DING PRECISION ELECTRONICS (HUAIAN) on July 22 for "Heat equalization plate" (Taiwanese, Chinese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,275, issued on July 22, was assigned to Avary Holding (Shenzhen) Co. Ltd. (Shenzhen, China) and QING DING PRECISION ELECTRONICS (HUAIAN) Co. LTD (Huai an, China).

"Heat equalization plate" was invented by Fu-Yun Shen (Shenzhen, China), Hsiao-Ting Hsu (New Taipei, Taiwan) and Ming-Jaan Ho (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The conne...