ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,834, issued on Sept. 9, was assigned to Avago Technologies International Sales Pte. Ltd. (Palo Alto, Calif.).
"Triple-sided module" was invented by Dingyou Zhang (San Jose, Calif.), Christopher Paul Wade (Los Gatos, Calif.), Li Sun (San Jose, Calif.) and Chris Chung (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes a first substrate comprising one or more first interconnection layers, wherein a first die is coupled to a first side of the first substrate, and a second substrate comprising one or more second interconnection layers. The second die may be coupled to a first side of the second substrate, and a third ...