US Patent Issued to Avago Technologies International Sales on Sept. 30 for "Stress and warpage improvements for stiffener ring package with exposed die(s)" (California Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,402, issued on Sept. 30, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore).

"Stress and warpage improvements for stiffener ring package with exposed die(s)" was invented by Sam Ziqun Zhao (Irvine, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package, and method for building the package is disclosed. The package includes a substrate having a first surface. The package further includes a die having opposing first and second surfaces, and a lateral surface, with the second surface of the die coupled to the first surface of the substrate. The package further includes a stiffener element having a first surface and a...