ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,398, issued on Sept. 30, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore).
"Interconnection array device with support" was invented by Sam Zhao (Irvine, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "It is described a interconnect array device (e.g., Ball Grid Array (BGA) device) comprising (a) a substrate having a substrate body and a main surface; (b) an array of solder connection elements formed at the main surface; and (c) a support structure formed at the main surface. The support structure is configured for maintaining, during a soldering process, a predefined spacing between the main surface of the substrat...