US Patent Issued to Avago Technologies International Sales on Oct. 7 for "Polymerized thermal interface material with surface modified liquid metal spheres and method of making" (American, Singaporean Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,062, issued on Oct. 7, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore).

"Polymerized thermal interface material with surface modified liquid metal spheres and method of making" was invented by Mayank Mayukh (Fort Collins, Colo.), Shrikara Prabhu Tendel (Singapore), Sam Karikalan (Irvine, Calif.) and Nicole A Butel (Fort Collins, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) package includes a one or more die, a package substrate, a thermal interface material, and a cover. The cover is disposed over or above the one or more die. The thermal interface material includes a surface modified me...