US Patent Issued to Avago Technologies International Sales on Oct. 21 for "Aggregation of multiple memory modules for a system-on-chip" (California, Oregon Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,450,178, issued on Oct. 21, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore).

"Aggregation of multiple memory modules for a system-on-chip" was invented by Anwar Ali (San Jose, Calif.), James Church (West Linn, Ore.) and Gokulnath Sulur (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system includes a substrate comprising a first circuit. The system also includes an integrated circuit formed in a first die disposed on the substrate. The integrated circuit includes at least a processor, a controller, and a first memory interface. The first memory interface is located in a first edge of the first die and i...