US Patent Issued to Avago Technologies International Sales on Nov. 4 for "Systems and methods for packaging semiconductor devices with scalable interconnects" (Colorado Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,324, issued on Nov. 4, was assigned to Avago Technologies International Sales Pte. Ltd. (Palo Alto, Calif.).

"Systems and methods for packaging semiconductor devices with scalable interconnects" was invented by Thomas Edward Dungan (Fort Collins, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is directed to semiconductor devices and packages. According to an exemplary embodiment, one or more substrate extensions are coupled to a base substrate, with portions of one or more substrates extending beyond the base substrate. Electrical and/or optical connections are connected to these substrate extensions. There are additional ...