US Patent Issued to AVAGO TECHNOLOGIES INTERNATIONAL SALES on June 3 for "Circuit packages and fabrication methods using bond-on-pad (BoP) substrate technology" (American, Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,690, issued on June 3, was assigned to AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. Ltd. (Singapore).

"Circuit packages and fabrication methods using bond-on-pad (BoP) substrate technology" was invented by Wen-Hsien Huang (Hsinchu, Taiwan) and Kwok Cheung Tsang (Irvine, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "One or more implementations of the subject technology may enable a bond-on-pad (BoP) substrate technology that can eliminate the need to utilize a solder-on-pad (SoP) process. Unlike an SoP process, a BoP Process does not require a solder bump to be formed on a bump pad to attach a joint to a bump pad. The size of an opening on a bu...