ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,597, issued on Feb. 3, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore).
"Partitioned overlapped copper-bonded interposers" was invented by Thomas Dungan (Fort Collins, Colo.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An interposer, and integrated circuit including an interposer, has a lower surface adapted for bump mounting and an upper surface adapted for copper bonding. An interposer layer includes active interposers and passive interposers. Bridges connect interposers in the interposer layer to produce a functionally large interposer from smaller interposer dies. A core may overlap more than one interposer in the i...