US Patent Issued to Avago Technologies International Sales on Dec. 2 for "Device having solder bump structure for improved mechanical, electrical, and/or thermal performance" (South Korean, American Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,042, issued on Dec. 2, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore).

"Device having solder bump structure for improved mechanical, electrical, and/or thermal performance" was invented by Michael Leary (San Jose, Calif.), Ah Ron Lee (Seoul, South Korea), Chris Chung (Seoul, South Korea), Yonglk Choi (Seoul, South Korea) and Domingo Figueredo (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some aspects, the disclosure is directed a module for improving mechanical, electrical, or thermal performance. In some embodiments, the module includes a bottom surface, a side surface, a first solder bump disposed...