US Patent Issued to AutoNetworks Technologies, Sumitomo Wiring Systems, Sumitomo Electric Industries on Sept. 23 for "Circuit device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,603, issued on Sept. 23, was assigned to AutoNetworks Technologies Ltd. (Yokkaichi, Japan), Sumitomo Wiring Systems Ltd. (Yokkaichi, Japan) and Sumitomo Electric Industries Ltd. (Osaka, Japan).

"Circuit device" was invented by Akira Haraguchi (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A first heat dissipation member is thermally connected to a first busbar. A second heat dissipation member is thermally connected to a second busbar. The first busbar and the second busbar respectively have a first facing part and a second facing part that face each other. The first facing part has a first surface on which a first electronic comp...