US Patent Issued to AUTONETWORKS TECHNOLOGIES, SUMITOMO WIRING SYSTEMS, SUMITOMO ELECTRIC INDUSTRIES on Oct. 14 for "Circuit assembly" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,167, issued on Oct. 14, was assigned to AUTONETWORKS TECHNOLOGIES LTD. (Mie, Japan), SUMITOMO WIRING SYSTEMS LTD. (Mie, Japan) and SUMITOMO ELECTRIC INDUSTRIES LTD. (Osaka, Japan).

"Circuit assembly" was invented by Taiji Yanagida (Osaka, Japan) and Hiroki Shimoda (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a circuit assembly having a novel structure capable of reducing thermal resistance in a heat-dissipating path and increasing heat dissipation while ensuring insulation between a heat-dissipating portion and a heat-dissipation target. A circuit assembly includes: heat-generating components that generate heat as a resu...