US Patent Issued to AURAS TECHNOLOGY on Feb. 18 for "Heat dissipation module" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,228,146, issued on Feb. 18, was assigned to AURAS TECHNOLOGY Co. LTD. (New Taipei, Taiwan).

"Heat dissipation module" was invented by Chih-Wei Chen (New Taipei, Taiwan), Cheng-Ju Chang (New Taipei, Taiwan), Hsiang-Chih Chuang (New Taipei, Taiwan), Jyun-Wei Huang (New Taipei, Taiwan) and Yi-Le Cheng (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation module includes a main vapor chamber, at least one auxiliary vapor chamber, a main heat dissipation fin set and at least one auxiliary heat dissipation fin set. The auxiliary vapor chamber is in fluid communication with the main vapor chamber, the main heat dissipation fin s...