ALEXANDRIA, Va., April 9 -- United States Patent no. 12,274,030, issued on April 8, was assigned to AURAS TECHNOLOGY Co. LTD. (New Taipei, Taiwan).

"Heat dissipation device" was invented by Chih-Wei Chen (New Taipei, Taiwan), Cheng-Ju Chang (New Taipei, Taiwan), Chung-Chien Su (New Taipei, Taiwan), Hsiang-Chih Chuang (New Taipei, Taiwan) and Jyun-Wei Huang (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation device includes a vapor chamber for contacting a heat source; at least one heat pipe having a first end and a second end connected to the vapor chamber; at least one partition disposed inside the heat pipe to partition the inside of the heat pipe into a first channel and ...